{"id":27442,"date":"2025-11-18T00:15:24","date_gmt":"2025-11-17T23:15:24","guid":{"rendered":"https:\/\/www.dica.polimi.it\/?p=27442"},"modified":"2026-03-13T15:27:33","modified_gmt":"2026-03-13T14:27:33","slug":"laboratory-of-mems-micromechanics-and-full-field-measurements-m3-lab","status":"publish","type":"post","link":"https:\/\/www.dica.polimi.it\/en\/laboratorio-dipartimentale\/laboratory-of-mems-micromechanics-and-full-field-measurements-m3-lab\/","title":{"rendered":"M3 LAB"},"content":{"rendered":"

Regarding microsystems, mechanical tests are carried out according to an on-chip logic, typically with capacitive operation, directly on silicon wafers or on \"singulated\" devices placed on a test bench equipped with a microscope (e.g., uniaxial tension, bending, fracture, dynamic tests); mechanical shear tests on microsystem bonds using an ad-hoc machine; characterization of the frequency response of microdevices using a laser vibrometer.<\/p>\n\n\n\n

As for field measurements at different observation scales, the following are available: digital cameras (including a motorized system with four degrees of freedom featuring a long stroke with micrometric resolution) for the acquisition of even time-lapse images with various lenses; digital image correlation (DIC) codes for kinematic measurements on flat surfaces (2D) or in volumes (3D, based on tomographic images). Several micro-apparatuses for in situ loading are also available to be interfaced with X-ray microtomography. Furthermore, the laboratory houses: a resin 3D printer for the study and creation of smart structures and metamaterials; a filament 3D printer.<\/p>\n\n\n\n

In summary, the activities can be detailed in the following points 1-3.<\/p>\n\n\n\n

    \n
  1. Mechanical testing on microsystems<\/strong>:\n
      \n
    • Capacitive on-chip testing<\/strong>\u00a0on silicon wafers or singulated devices, performed on a test bench with a microscope. The tests include: uniaxial tension, bending, fracture, and dynamic testing.\n
        \n
      • Static uniaxial tensile and bending tests<\/strong><\/li>\n\n\n\n
      • Fracture tests on micro-notched specimens<\/strong><\/li>\n\n\n\n
      • Dynamic testing<\/strong><\/li>\n\n\n\n
      • Mechanical shear testing<\/strong> on microsystem bonds, performed with a dedicated machine.<\/li>\n\n\n\n
      • Measurement of the frequency response with a laser Doppler vibrometer.<\/strong><\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n\n\n\n
      • Field measurements at different scales<\/strong>:\n
          \n
        • Use of\u00a0digital cameras<\/strong>\u00a0for image acquisition, including\u00a0time-lapse images<\/strong>\u00a0with a motorized four-degree-of-freedom system, equipped with\u00a0micrometric resolution<\/strong>\u00a0and long stroke.<\/li>\n\n\n\n
        • Application of\u00a0digital image correlation (DIC) codes<\/strong>\u00a0for kinematic measurements:\n
            \n
          • On planar surfaces (2D)<\/strong><\/li>\n\n\n\n
          • In 3D volumes<\/strong> (using tomographic images).<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<\/li>\n\n\n\n
          • Micro-devices for in-situ loading<\/strong>:\n
              \n
            • Availability of micro-devices for\u00a0in-situ loading<\/strong>\u00a0to be interfaced with\u00a0X-ray microtomography system<\/strong>, for advanced stress analysis on microsystems.<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n\n\n\n

              These advanced technologies allow for detailed analysis of microsystems<\/strong> and small-scale materials<\/strong>, essential for the development of innovative devices and technologies in various industrial and research fields.<\/p>","protected":false},"excerpt":{"rendered":"

              Laboratory of MEMS, Micromechanics and full field Measurements<\/p>","protected":false},"author":11,"featured_media":27207,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"_price":"","_stock":"","_tribe_ticket_header":"","_tribe_default_ticket_provider":"","_tribe_ticket_capacity":"0","_ticket_start_date":"","_ticket_end_date":"","_tribe_ticket_show_description":"","_tribe_ticket_show_not_going":false,"_tribe_ticket_use_global_stock":"","_tribe_ticket_global_stock_level":"","_global_stock_mode":"","_global_stock_cap":"","_tribe_rsvp_for_event":"","_tribe_ticket_going_count":"","_tribe_ticket_not_going_count":"","_tribe_tickets_list":"[]","_tribe_ticket_has_attendee_info_fields":false,"footnotes":""},"categories":[911],"tags":[],"class_list":["post-27442","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-laboratorio-dipartimentale"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.dica.polimi.it\/en\/wp-json\/wp\/v2\/posts\/27442","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.dica.polimi.it\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.dica.polimi.it\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.dica.polimi.it\/en\/wp-json\/wp\/v2\/users\/11"}],"replies":[{"embeddable":true,"href":"https:\/\/www.dica.polimi.it\/en\/wp-json\/wp\/v2\/comments?post=27442"}],"version-history":[{"count":4,"href":"https:\/\/www.dica.polimi.it\/en\/wp-json\/wp\/v2\/posts\/27442\/revisions"}],"predecessor-version":[{"id":30639,"href":"https:\/\/www.dica.polimi.it\/en\/wp-json\/wp\/v2\/posts\/27442\/revisions\/30639"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.dica.polimi.it\/en\/wp-json\/wp\/v2\/media\/27207"}],"wp:attachment":[{"href":"https:\/\/www.dica.polimi.it\/en\/wp-json\/wp\/v2\/media?parent=27442"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.dica.polimi.it\/en\/wp-json\/wp\/v2\/categories?post=27442"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.dica.polimi.it\/en\/wp-json\/wp\/v2\/tags?post=27442"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}