{"id":33365,"global_id":"www.dica.polimi.it\/en?id=33365","global_id_lineage":["www.dica.polimi.it\/en?id=33365"],"author":"6","status":"publish","date":"2026-05-20 15:01:48","date_utc":"2026-05-20 13:01:48","modified":"2026-05-20 15:01:48","modified_utc":"2026-05-20 13:01:48","url":"https:\/\/www.dica.polimi.it\/en\/evento\/model-order-reduction-for-secure-model-exchange-in-microelectronic-design\/","rest_url":"https:\/\/www.dica.polimi.it\/en\/wp-json\/tribe\/events\/v1\/events\/33365","title":"Model Order Reduction for Secure Model Exchange in Microelectronic Design","description":"<p>On<strong>\u00a0Monday, May 25<\/strong>, a\u00a0seminar\u00a0titled\u00a0<strong><em>\u201cModel Order Reduction for Secure Model Exchange in Microelectronic Design\u201d\u00a0<\/em><\/strong>will be held in Grandori Room (Building 4) from 10:00 CET.<\/p>\n<p>The seminar will be given by <strong>Tamara Bechtold<\/strong>, Full Professor of Applied Sciences at Jade University.<\/p>\n<p><strong>Abstract<\/strong><\/p>\n<p>In the development cycle of microelectronic components and systems, conducting comprehensive reliability assessments in a virtual environment can substantially reduce the costs associated with manufacturing physical prototypes. Within this simulation-based workflow, component manufacturers are often required to share component models with partners across the value chain while simultaneously protecting their intellectual property. Model order reduction techniques provide an effective solution by enabling the creation of highly accurate compact models that obscure sensitive product details such as material properties and geometric features. For system manufacturers integrating multiple components on a printed circuit board, these compact models can be reintroduced into finite element simulations via super-element techniques to perform virtual reliability assessments.<\/p>\n<p><strong>Bio-sketch<\/strong><\/p>\n<p>Tamara Bechtold obtained her PhD in microsystem simulation from the University of Freiburg, Germany, in 2005. Between 2006 and 2010, Dr. Bechtold worked as a research engineer at Philips Research Laboratories and NXP Semiconductors in Eindhoven, the Netherlands. The objective of her research was to enhance the standard IC design flow through model order reduction and optimization modules.<\/p>\n<p>From 2011 to 2014, she served as an interim professor for microsystems simulation at the University of Freiburg, Germany, and since 2014, she has been a lecturer and research group leader at the University of Rostock, Germany. Since 2017, Dr. Bechtold has been a full professor of mechatronic systems at Jade University of Applied Sciences in Wilhelmshaven, Germany. Since 2022 she has been a managing director of Steinbeis Transfer Center.<\/p>\n<p>Dr. Bechtold is the author and co-author of over 150 technical publications in the area of modelling and simulation of micro-mechatronic systems. She is the lead author of the textbook Fast Simulations of Electro-Thermal Microsystems: Efficient Dynamic Compact Models, published by Springer, and the main editor of the textbook System-Level Modeling of MEMS, published in the Wiley-VCH book series on Advanced Micro- and Nanosystems.<\/p>\n<p>Her research interests include the application of advanced mathematical methods, such as model order reduction and topology optimization, to engineering problems, as well as multi-physics modelling at both the device and system 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