Regarding microsystems, mechanical tests are carried out according to an on-chip logic, typically with capacitive operation, directly on silicon wafers or on "singulated" devices placed on a test bench equipped with a microscope (e.g., uniaxial tension, bending, fracture, dynamic tests); mechanical shear tests on microsystem bonds using an ad-hoc machine; characterization of the frequency response of microdevices using a laser vibrometer.
As for field measurements at different observation scales, the following are available: digital cameras (including a motorized system with four degrees of freedom featuring a long stroke with micrometric resolution) for the acquisition of even time-lapse images with various lenses; digital image correlation (DIC) codes for kinematic measurements on flat surfaces (2D) or in volumes (3D, based on tomographic images). Several micro-apparatuses for in situ loading are also available to be interfaced with X-ray microtomography. Furthermore, the laboratory houses: a resin 3D printer for the study and creation of smart structures and metamaterials; a filament 3D printer.
In summary, the activities can be detailed in the following points 1-3.
- Mechanical testing on microsystems:
- Capacitive on-chip testing on silicon wafers or singulated devices, performed on a test bench with a microscope. The tests include: uniaxial tension, bending, fracture, and dynamic testing.
- Static uniaxial tensile and bending tests
- Fracture tests on micro-notched specimens
- Dynamic testing
- Mechanical shear testing on microsystem bonds, performed with a dedicated machine.
- Measurement of the frequency response with a laser Doppler vibrometer.
- Capacitive on-chip testing on silicon wafers or singulated devices, performed on a test bench with a microscope. The tests include: uniaxial tension, bending, fracture, and dynamic testing.
- Field measurements at different scales:
- Use of digital cameras for image acquisition, including time-lapse images with a motorized four-degree-of-freedom system, equipped with micrometric resolution and long stroke.
- Application of digital image correlation (DIC) codes for kinematic measurements:
- On planar surfaces (2D)
- In 3D volumes (using tomographic images).
- Micro-devices for in-situ loading:
- Availability of micro-devices for in-situ loading to be interfaced with X-ray microtomography system, for advanced stress analysis on microsystems.
These advanced technologies allow for detailed analysis of microsystems and small-scale materials, essential for the development of innovative devices and technologies in various industrial and research fields.